PIEZOELECTRIC OSCILLATOR, AND COMMUNICATION DEVICE AND ELECTRONIC DEVICE PROVIDED WITH SUCH PIEZOELECTRIC OSCILLATOR

摘要

A package structure for a piezoelectric oscillator for further size reduction and thinning of the piezoelectric oscillator. The piezoelectric oscillator is provided with a first package (2) wherein a circuit element (1) for constituting an oscillation circuit is stored, and a second package (4) which is fixed over the first package and has a piezoelectric oscillating element (3) stored inside. The first package (2) includes a lead frame (5) and a transfer lead frame (6), and some of the ends of the lead frame (5) are permitted to be external terminals (5b) exposed by facing the outer plane of the first package by being bent. The transfer lead frame (6) is so formed as to have the ends of a wiring pattern exposed by facing a peeling plane side of a molded resin as external terminals (6a), by arranging the wiring pattern on the base material during resin molding and peeling the base material after the resin molding.