PHOTOSENSITIVE RESIN COMPOSITION

摘要

A photosensitive resin composition for fabricating inter-insulation layer of LCD is provided to have excellent performance such as sensitivity, heat resistance and resolution, and improve storage stability at high temperature and transmission by comprising acrylic copolymer, 1,2-quinonediazide compound and epoxy compound in the composition. The composition comprises: (a) 100wt. parts of acrylic copolymer prepared by copolymerizing (i) 5-50wt.% of unsaturated carboxylic acid, unsaturated carboxylic acid anhydride and mixture thereof, (ii) 5-50wt.% of olefin based unsaturated compound containing hydroxy group and (iii) 5-70wt.% of another olefin based unsaturated compound, and then removing unreacted monomer from the product; (b) 5-50wt. parts of 1,2-quinonediazide compound; (c) 1-50wt. parts of epoxy cross-linking agent with specific formulae(1) to (6), wherein R is hydrocarbon group containing 1 to 10 of hydrocarbon groups and n is any of 1 to 5; and (d) solvent with solid content of 10-50wt.% in the composition.