发明名称 METHOD OF PREPARING LOW RESISTANCE METAL PATTERN, PATTERNED METAL WIRE STRUCTURE, AND DISPLAY DEVICES USING THE SAME
摘要 <p>A method for forming a low-resistance metal pattern, a metal pattern structure and a display device having the same are provided to effectively obtain the low-resistance metal pattern in a short time by using a wet puttering process, without performing a sputtering process. After a surface of a substrate with a pattern is activated to form plural metal nuclei, and a plating layer(50) is formed on the activated surface of the substrate to form a low-resistance metal pattern. Prior to activation of the substrate, a sensitization process is performed on the substrate using a copper compound. The sensitization process includes forming a lower conductive line on the substrate, performing the sensitization process on the lower conductive line, activating the substrate for form plural catalytic metal nuclei, and forming at least one plating layer on the catalytic layer.</p>
申请公布号 KR100807948(B1) 申请公布日期 2008.02.28
申请号 KR20070020168 申请日期 2007.02.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SONG, KI YONG;CHO, SUNG HEN;PARK, SANG EUN
分类号 H01L29/786;H01L21/288 主分类号 H01L29/786
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