| 摘要 |
PROBLEM TO BE SOLVED: To make a semiconductor chip separable from a board after a semiconductor device is manufactured so that the device can be repaired and the yield of the device can be improved by soldering one ends of wires to the electrodes of the semiconductor chip and the other ends of the wires to the electrodes of a wiring board. SOLUTION: A silicon chip 10 constituted as the semiconductor chip of a semiconductor device in which an integrated circuit containing a semiconductor element is formed electrically and mechanically connected to the wiring board 21 of a computer module, etc., through many wires 40. When the chip 10 is connected to the board 21 through the wires 40, one ends of the wires 10 are soldered to the electrodes 11 of the chip 10 and the other ends of the wires 40 are soldered to the electrodes 32 of the wiring board 21. Consequently, the wires 40 can be separated from the electrodes 11 and 32 by heating the soldered sections 34 and 43. Therefore, the yield of a semiconductor device can be improved, because the device can be repaired after manufacture. |
