摘要 |
A printed wiring board includes: a component mounting region; a plurality of electrode pads arranged at a peripheral edge portion of the component mounting region; a solder resist film that coats the component mounting region; and a plurality of solder bonding faces arranged at a region surrounded by the plurality of electrode pads. The solder resist film and the plurality of solder bonding faces form an island-shaped pattern such that the plurality of solder bonding faces are isolated with each other by the solder resist film.
|