发明名称 SURFACE MOUNT TYPE INDUCTOR ARRAY APPARATUS
摘要 A surface mount type inductor array apparatus is provided to prevent the leakage of the magnetic flux by sealing the upper part of a ring core. A surface mounting type inductor array apparatus includes two drum cores(200) or more, a base(100), and a ring core(300). The drum core includes a drum unit, an upper flange(220), and a lower flange. An inductor coil is wound around the drum unit. The upper flange and the lower flange are formed in the upper part and the lower part of the drum unit respectively. The base includes two drum core mounting grooves, a pair of coil connecting pieces, and a substrate connecting contact point unit. Both ends of the inductor coil are connected to the pair of the coil connecting pieces. The substrate connecting contact point unit is contacted with the electrode pad of the surface of the printed circuit board. Two drum core receiving holes(301,302) or more are formed in the ring core. The drum core receiving hole surrounds the drum core received in the drum core receiving groove.
申请公布号 KR20090040798(A) 申请公布日期 2009.04.27
申请号 KR20070106317 申请日期 2007.10.22
申请人 BUJEON ELECTRONICS CO., LTD. 发明人 MIN, BYUNG CHANG
分类号 H01F27/24 主分类号 H01F27/24
代理机构 代理人
主权项
地址