| 摘要 |
A probe card for a wafer test is provided to minimize influence of the thermal deformation in a main board and a main frame by installing the probe board to be separated from the main board. A main board(10) has a first side, and a second side opposite to the first side. A main frame(20) is installed in the first side of the main board. A first support frame(30) is installed on the main frame. A probe board(40) is installed in the second side of the main board by an interposer with elasticity. A second support frame(60) is coupled to an outer part of the probe board. A coupling member(70) passes through the main board and the main frame and couples the first support frame and the second support frame. The coupling member installs the second support frame separately in the second side of the main board.
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