| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable substrate for a power module, having high radiation performance and causing no crack in a ceramic plate while a warp is suppressed.SOLUTION: In a substrate for a power module, ceramic plates 16, 21 are bonded to both sides of a heat dissipation substrate 13 made of copper, copper alloy, or aluminum alloy respectively through first metal layers 17, 19, a circuit layer 18 is bonded to the side opposite to the first metal layer 17 of one ceramic plate 16, and a second metal layer 20 is bonded to the side opposite to the first metal layer 19 of the other ceramic plate 21. The heat dissipation substrate and the first metal layer are made of a dissimilar material or a homogeneous and heterogeneous material. Either one of the heat dissipation substrate 13 and the circuit layer 18 is made of copper or copper alloy. Either one combination of the heat dissipation substrate 13, the first metal layers 17, 19, the circuit layer 18, and the second metal layer 20 is a dissimilar material. The thickness of the heat dissipation substrate 13 is thicker than the thickness of the first metal layers 17, 19 and the second metal layer 20, and the area of the ceramic plates 16, 21 is smaller than the area of the heat dissipation substrate 13.SELECTED DRAWING: Figure 1 |
