| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the polishing slurry feeding method and its device, which feeds polishing slurry to an abutting surface of a polishing pad with the polishing surface of a substrate such as a wafer and the like, and can make the polishing slurry stay in the abutting surface. SOLUTION: A slurry feeding through hole 13 communicated with a slurry feeding source 8 is provided for the center part of a polishing head 2 allowing its polishing pad 3 to abut against a substrate W comparatively large in diameter, a slurry sucking tube 11 communicated with a slurry sucking source 9 is inserted into the inside of a through hole 13 so as to be disposed, and the polishing pad 3 is mounted thereto, in which a through hole 5 and a plurality of radial grooves 6 are provided for the lower surface of the polishing head 2. Polishing slurry is fed to the abutting surface of the polishing pad 3 with the substrate W through the through hole 13, and chemical-mechanical polishing is thereby performed while polishing slurry fed through the slurry sucking tube 11 is being sucked up.</p> |
