| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed integrated circuit device which enables easy molding and reliable prevention of generation of package crack, and manufacture thereof. SOLUTION: This device includes an IC chip 1 having an integrated circuit formed thereon, and leads 2a, 2b connected with terminals of the chip. The device also has an inner resin layer 4 of low stress which encloses the chip 1 and chip lateral end portions of the leads 2a, 2b, and an outer resin layer 5 of high strength and low hygroscopicity which encloses the inner resin layer. The resin layers 4, 5 have shapes substantially analogous to each other. Manufacture of this integrated circuit device includes a first molding step of forming the inner resin layer for enclosing the chip 1 and the chip lateral end portions of the leads 2a, 2b with a low-stress resin, using a metal mold having a first cavity of a predetermined shape, and a second molding step of forming the outer resin layer 5 for enclosing the inner resin layer 4 with a resin of high strength and low hygroscopicity, using a metal mold having a second cavity of a shape analogous to and greater than the predetermined shape. |
