| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which is less likely to cause defects.SOLUTION: A wiring board manufacturing method of the present embodiment includes an intermediate substrate manufacturing process, an insulation layer formation process, a column removal process and a conductor formation process. In the intermediate substrate formation process, an intermediate substrate 20 including a blind hole 22 formed in a semiconductor substrate 2, a semiconductor column 10 standing in the blind hole 22 and an edge region 23 which is a portion of the semiconductor substrate 2 near an edge of the blind bole 22 and lower than the semiconductor column 10 is manufactured by etching. In the insulation layer formation process, an insulating material is filled in the blind hole 22 of the manufactured intermediate substrate 20 to form an insulation layer 3. In the column removal process, etching is performed after the insulation layer formation process to remove the semiconductor column 10 to form a columnar conductor hole. In the conductor formation process, a conductive material is filled in the columnar conductor hole to form a columnar conductor 4.SELECTED DRAWING: Figure 6 |
