| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of measuring curing behavior of curable liquid resin, which allows for quantifying and visualizing curing and post-curing behavior of various curable liquid resins through a simple procedure.SOLUTION: A method of the present invention for measuring curing behavior of a curable liquid resin includes the steps of: filling a space between a pair of oppositely-arranged probes with the curable liquid resin; curing the curable liquid resin; vibrating one probe of the pair of probes; and making temporal measurement of stress or displacement acting on the other probe caused by the vibration of the one probe, or stress acting on the one probe. In the vibrating step, amplitude of the vibration of the one probe may preferably be increased when the curable liquid resin is cured. In the measurement step, the other probe may preferably be movable when measuring the stress or displacement acting on the other probe. The method may preferably include a step for temporally recording the stress or displacement acquired in the measurement step.SELECTED DRAWING: Figure 3 |
