| 摘要 |
1453174 Electroless plating with Ni or Co E I DU PONT DE NEMOURS & CO 14 Aug 1974 [15 Aug 1973] 35802/74 Heading C7F In the Ni or Co electroless plating of a substrate which is: Cu, stainless steel, Fe-Ni-Co alloys, Ag, sintered fritted oxide powders and a metal selected from Au, Ag, Pt, tin oxide and antimony oxide, and a sintered mixture of Mo and manganese oxide, the substrate is contacted with an alkali metal borohydride, an alkali metal cyanoborohydride or an amine borane, prior to plating. The substrate may be first contacted with ammonium persulphate. In Examples the plating solutions may comprise (g./l.) 50 nickel acetate, 25 lactic acid, 25 sodium citrate, 0.1 thiodiglycolic acid, 2.5 dimethylamine borane, 0.1 wetting agent, and 30 nickel chloride hexahydrate, 60 ethylenediamine, 40 NaOH, 0.3 sodium borohydride, and 50 thallium sulphate. |
