| 摘要 |
PROBLEM TO BE SOLVED: To simply accomplish electric connection in a package and hermetic sealing a high frequency device. SOLUTION: A GND electrode 9, signal electrode 10 and power source electrode 11 are mounted on the surface of a microwave IC 1 bonded to a base 2. A GND lead 14, signal lead 15 and power lead 4 are connected by the thermocompression to the electrodes 9, 10 and 11. On the base 2 a resin 7 is dripped over the microwave IC and hardened to seal this IC. |
