SEMICONDUCTOR DEVICE, MODULE STRUCTURE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To enable a plurality of semiconductor devices with leads of the same shape to be superimposed on each other in the form of a multistage. SOLUTION: In the case wherein this device 1 has two leads 5 connected electrically with an external terminal 2A of a semiconductor chip 2, and each lead 5 is present on the outside of one of both the opposite side surfaces of the semiconductor chip 2, each lead 5 is constituted to have a first portion 3 extended nearly in parallel with the principal surface of the semiconductor chip 2 and a second portion 4 extended in an acute angle with respect to the first portion 3.