摘要 |
PURPOSE:To improve cooling efficiency by preventing film boiling state by cooling the part of a semiconductor element concentrically in a cooled container. CONSTITUTION:A fin 4 is arranged above the semiconductor element 1 in a cooled container. Grooves 7 are formed on the inside wall of the cooled container. Then, the heat of the element 1 is transmitted to a cooling medium 2 to generate bubbles of steam 3. The generated steam is cooled by the fin 4 to become cooling medium liquid 6 which flows on the element 1 and cools the element 1 and the liquid around it concentrically. |