| 摘要 |
A solderless connector for effecting the connection between a multi-layer flexible circuit and other electronic circuit devices is presented. A first embodiment of the present invention is characterized by wrapping separated layers of a two or more layer flexible circuit about an elastomeric resilient member such that the terminal ends of each layer are provided on one side of the resilient member. In a second embodiment of the present invention, a multi-layer flexible circuit is provided with successive steps formed in each layer wherein the terminating portions of each circuit layer have a progressively longer length. This stepped multi-layer flexible circuit is then used in conjunction with a correspondingly stepped rigid retainer plate wherein a resilient elastomeric member is positioned between the stepped flexible circuit and the steps of the rigid retainer plate such that uniform pressure is maintained on all layers during interconnection with another electronic circuit device.
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