METHOD FOR MANUFACTURING AN ELECTRIC AND MECHANICAL CONNEXION IN A CHIP CARD MODULE PLACED IN A CARD HOLDER RECESS

摘要

Disclosed is a process for manufacturing an electric and mechanical connexion in a chip card module (10) placed in a card holder recess (12) by means of a hot-melt or hot-melt-type adhesive. According to the invention, a non-conductive hot-melt or hot-melt-type adhesive applied on a film-like support in the portion where there are to be electrical contacts (15) between the module and the card holder, is covered with an additional conductive layer or with conductive particles (16). Such prepared adhesive layer is then deposited onto the module (10) or into the card holder recess so that the portions covered with said additional conductive layer or conductive particles (16) are located between the module contact surfaces and the card holder recess, this operation being followed by mechanically linking and electrically connecting said module (10) in one single step using pressure and temperature and card holder. The invention also relates to an assembly tool and related connecting process.