| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a semiconductor package and enhance the scale of integration of the package. SOLUTION: A first assembly includes a plurality of leads 10 having first leads 10a with protrusions 11 formed on one side, and second leads 10b bended stepwise obliquely above one side of the first lead 10a, and a semiconductor chip 13 wherein chip pads 13a formed on the surface are connected to the protrusions 11 via solder. A second assembly is of the same construction as the first assembly, and is provided symmetrically with respect to a plane, with the surfaces to which the first assembly and the semiconductor chip 13 are connected opposed. The corresponding second leads 10b are connected to each other via adhesive portions 30. Molding portions 40 in which the first assembly and the second assembly are sealed with the other surface of the first leads 10a and the tips of the second leads 10b exposed. A stackable bottom lead semiconductor package comprises the first assembly, the second assembly, and molding portions 40. |
