| 发明名称 |
Method for producing printed circuit boards |
| 摘要 |
A method for producing circuit boards with a film having improved printing properties, adhesion, flexibility and heat resistance which comprises applying a liquid printing ink composition comprising an admixture of a solvent, a polyamide-acid and a partially imidized polyamide-acid, then heat to effect drying and curing.
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| 申请公布号 |
US5254361(A) |
申请公布日期 |
1993.10.19 |
| 申请号 |
US19920826773 |
申请日期 |
1992.02.13 |
| 申请人 |
CHISSO CORPORATION |
发明人 |
KAWAMOTO, TAKAO;YANO, HITOSHI;KIKUTA, KAZUTSUNE;KONOTSUNE, SHIRO |
| 分类号 |
C08L79/08;C09D11/10;H05K1/00;H05K3/28;(IPC1-7):B05D5/12 |
主分类号 |
C08L79/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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