发明名称 SPUTTERING TARGET FOR FORMATION OF HIGH DIELECTRIC FILM
摘要 PROBLEM TO BE SOLVED: To obtain a sputtering target for formation of high dielectric film, free from occurrence of soft error, by specifying the<226> Ra concentration of the compound oxide of Ba and Ti and forming a perovskite structure. SOLUTION: By constituting a sputtering target of a compound oxide of Ba and Ti or a compound oxide of Ca, Sr, and Ti, in which the concentration of Ra with 226 mass number (<226> Ra) is regulated to <=50mBq/g, and also providing a perovskite structure, the sputtering target, capable of forming an oxide high dielectric film, in which alpha dosage is <=0.01CPH/cm<2> and occurrence of soft error is negligible, can be obtained. This target can be formed by mixing the powders of organic salts of Ba, Sr, and Ti, each having<226> Ra concentration reduced to <=50mBq/g, burning the resultant powder mixture, and subjecting the resultant compound oxide powder to hot pressing.
申请公布号 JPH1060635(A) 申请公布日期 1998.03.03
申请号 JP19960219957 申请日期 1996.08.21
申请人 MITSUBISHI MATERIALS CORP 发明人 MORI AKIRA;UCHIYAMA NAOKI;ODA JUNICHI
分类号 C04B35/46;C23C14/08;C23C14/34;H01L21/203;H01L21/285;H01L21/31;H01L21/8242;H01L27/108 主分类号 C04B35/46
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