| 摘要 |
PURPOSE:To provide a heat-resistant adhesive material having high adhesive power and excellent heat-resistance, electrical characteristics, chemical resistance, etc., by laminating a heat-resistant adhesive composed of a polyimide resin at a specific thickness to a polyphenylene sulfide resin film. CONSTITUTION:This heat-resistant adhesive material is a laminate containing a heat-resistant adhesive on one or both surfaces of a polyphenylene sulfide resin film, wherein at least one of the adhesive layer is a polyimide resin layer having a thickness of 5.5-15mum. The polyimide resin film is preferably a thin film produced by reacting an aromatic tetracarboxylic acid such as 3,3',4,4'- benzophenonetetracarboxylic acid dianhydride with a diamine component containing 75-96mol% of a siloxane-based diamine of formula ((n) is >=1; R1 and R2 each is a lower alkylene or a phenylene; R3 to R6 each is phenyl, phenoxy, etc.) and imidating the obtained polyamic acid. The diamine component is preferably incorporated with 15-50mol% of 4,4'-diaminodiphenylsulfone to improve the adhesivity. |
