| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer fixing equipment which can improve the yield of a semiconductor wafer and increase fixing force. SOLUTION: This equipment consists of a platen having a flat upper surface on which a semiconductor wafer 10 is put, an O ring which is positioned between the platen and the semiconductor wafer 10 and has elasticity, and a clamp 50' which is positioned facing the O ring and presses the upper surface of the semiconductor wafer 10 to fix it. The clamp 50' is a ring plate having an inner diameter larger than the diameter of the semiconductor wafer 10, and many protrusions are formed from the inner peripheral surface toward the center, so as to correspond to the position where the interval between the chip pattern 11 and the outer peripheral surface of the semiconductor wafer 10 is made at least a specified value by the chip pattern 11 on the semiconductor wafer 10. By fixing only the edge part of the wafer in such a manner that the semiconductor chip is not damaged by the chip pattern 11 on the semiconductor wafer 10, both the yield and the fixing force can be improved.</p> |
