Schutzschaltung auf einem Leiter einer Leistungsanordnung

摘要

A method for protecting a semiconductor power die (16) has been provided. The method involves inserting an integrated circuit die (10) between the gate lead (14) of a package containing the semiconductor power die and the actual gate terminal (24) of the semiconductor power die. As a result, any current flowing into the gate lead of the package must pass through the integrated circuit die before entering the semiconductor power die. This allows the integrated circuit die to monitor and control the semiconductor power die.