| 摘要 |
PROBLEM TO BE SOLVED: To produce a high-performance and high-quality circuit board, by stably adhering a prepreg sheet and plastic sheet to produce a high-quality sheet for the board, without causing air voids and wrinkles due to the voids. SOLUTION: The circuit board manufacturing method comprises adhering a prepreg sheet 1 to a plastic sheet 2 to form a sheet for the board, forming through-holes through this sheet, charging a conductive paste in the through- holes, peeling the plastic sheet 2 and lining metal foils on the front and back surfaces of the prepreg sheet 1, and etching the metal foils to form circuits. To adhere the prepreg sheet 1 to the plastic sheet 2, evacuation is applied to remove air between both sheets 1, 2. |
