发明名称 MULTI-LAYER PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To confirm, non-conformity of each circuit layer lamination position, with naked eye, by comprising a non-conformity identification band at a router cutting plane which makes possible identification of conformity/non-conformity in lamination position of each circuit layer with naked eye, and so forming that the center identification band is, at each circuit layer, arrayed in a line in the thickness direction of circuit layer with the same length. SOLUTION: After a plurality of circuit layers are laminated, and before a board is cut along a router pass, a non-conformity identification band 310 and a layer-alternation identification band 310 are formed by an outer process on the router pass of each copper foil laminated board (CCL). The identification band formed at a cutting part of each layer is so formed that its center recedes from the center of identification band formed at the lowest layer in order with, preferably, the same length. As a result, non-conformity in lamination position of product and alternation of circuit layers, etc., are conformed with ease and sure, while reliability for circuit board characteristics is assured, so that outflow of defective products into market is prevented with improved reliability for product.
申请公布号 JPH10163631(A) 申请公布日期 1998.06.19
申请号 JP19970267500 申请日期 1997.09.30
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 YANG DEOK GIN
分类号 H05K1/02;H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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