发明名称 PACKAGE FOR ELECTRONIC COMPONENT ACCOMMODATION
摘要 PROBLEM TO BE SOLVED: To provide a package for electronic component accommodation which can effectively prevent the penetration of noise into an electronic component accommodated within the package, to thereby have the electronic component operate normally and stably for a long period of time. SOLUTION: This package for electronic component accommodation includes a base 2 having a signal line 5a and a ground line 5b and also having a mount A for carrying an electronic component 4 thereon, and also includes a lid member 3 having a recess B for accommodating therein the electronic component 4 mounted on the mount A. The part 4 can be accommodated airtightly in the package by mounting the lid member 3 on the base 2 with a sealing material 8 therebetween. At least a part of a signal line 5a of the base 2 contains magnetic particles, and the signal line is surrounded by the ground line 5b. A metal layer 9 having a plurality of triangular prism-like projections arranged thereon is applied on an inner wall of the recess of the lid member 3, and the layer 9 is connected electrically to the ground line 5b of the base 2.
申请公布号 JPH11233661(A) 申请公布日期 1999.08.27
申请号 JP19980035100 申请日期 1998.02.17
申请人 KYOCERA CORP 发明人 NABE YOSHIHIRO;YOMO KUNIHIDE
分类号 H01L23/12;H01L23/02;H01L23/04;H01L23/10;H01L23/14;(IPC1-7):H01L23/04 主分类号 H01L23/12
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