| 摘要 |
PROBLEM TO BE SOLVED: To provide an optically coupled relay device which can be packaged in a thin type package while maintaining a thermal stress capability without losing electrical insulating capability and optical coupling capability between primary and secondary circuits. SOLUTION: The device comprises light emitting means 4 for emitting light based on an input signal, photoreception means 2 for receiving the light emitted by the light emitting means 4 and generating a photoreception signal, and switch means 5A and 5B which become electrically conductive based on the photoreception signal. The light emitting means 4 is provided on a photoreception surface of the photoreception means 2 via a substrate 3 having insulating and light-transmitting characteristics. By selecting the characteristic of the substrate 3, the size in a longitudinal direction can be reduced without losing electrical insulating capability and optical coupling capability between the primary and secondary circuits. |
