| 摘要 |
PROBLEM TO BE SOLVED: To distribute slurry in a uniform layer extending over the whole of a polishing pad to improve the uniformity of flattening by communicating a slurry reservoir formed on a carrier head to feed polishing slurry from the reservoir to the polishing pad with the bottom of a retaining ring. SOLUTION: A part of the upper surface 124 of a retaining ring projected outward from a housing 102 has a trough 112 for holding slurry, which is an annular recess extending over the whole of the periphery of a carrier head. An inside inclined lip 114 of the trough 112 prevents slurry from being spilled on the trough 112 by centrifugal force, and plural passages including substantially diagonal line part 140 inclined at an internal angle toward the rotation axis of the carrier head and a substantially vertical part 142 are formed to pierce the retaining ring 110. Thus, the trough 112 is communicated with the bottom 122 of the retaining ring 110 so that polishing slurry in the trough 112 is let flow out through the passages by action of gravity to be accumulated on the surface of a polishing pad 32. |
