| 摘要 |
PROBLEM TO BE SOLVED: To prevent interfacial separations and cracks from occurring in packages when surface mounted-type resin-sealed semiconductor devices are mounted. SOLUTION: At least one surface mounted-type semiconductor package 12 and a laminated bag 11 having surface mounted-type semiconductor packages housed therein are provided. The laminated bag 11 comprises an aluminum foil serving as a barrier against water vapor and a polyethylene layer mixed with an antistatic agent provided at the inside of the aluminum foil. The polyethylene layers each mixed with the antistatic agent at the inside of the aluminum foils are pressure welded together, and thereby the laminated bag 11 is sealed up. The laminated bag 11 carries instructions indicating that the surface mounted-type semiconductor packages 12 should be used quickly after unsealing the bag or the bag should be placed again under the circumstances having less humidity. |
