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发明名称
APPARATUS AND METHODS OF REINFORCEMENT OF LEAD BONDING IN MICROELECTRONIC PACKAGES
摘要
申请公布号
KR20020030086(A)
申请公布日期
2002.04.22
申请号
KR1020027001220
申请日期
2002.01.29
申请人
发明人
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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