发明名称 Halbleiteranordnung
摘要 There is described a semiconductor device (1) wherein an auxiliary electrode (12) is connected to a first auxiliary terminal (71) on one plane of a semiconductor piece that is fixed on a support plate (2) and a main electrode (11) is connected to a main terminal (6) and a second auxiliary terminal (72), the terminals (71,72) each comprising a horizontal conductor strip (41,42) and a terminal portion (71,72) extending vertically upwardly from the support plate (2) and being connected to their respective electrode (11,12) by wires (51,52) attached to their conductor strips (41,42) characterised in that the main current is controlled by a voltage applied across the first (71) and second (72) auxiliary terminals, and the wire (54) that connects the main terminal (6) to the second auxiliary terminal (72) is connected to the conductor strip (41) of the main terminal (6) adjacent its upstanding terminal portion (72). <IMAGE>
申请公布号 DE69127494(T2) 申请公布日期 1998.03.19
申请号 DE1991627494T 申请日期 1991.02.20
申请人 FUJI ELECTRIC CO., LTD., KAWASAKI, KANAGAWA, JP 发明人 FURUHATA, SHOOICHI, MATUMOTO, JP;KOBAYASHI, SUSUMU, MATUMOTO, JP
分类号 H01L23/62;H01L23/495;H01L23/64;H01L25/07;H02M7/00 主分类号 H01L23/62
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