| 摘要 |
PROBLEM TO BE SOLVED: To prevent trouble generation caused by double-folded glasses mounted on a package comprising a semiconductor device. SOLUTION: A collet 7 which sucks and holds a glass 4 is attached at the top of a shaft 13 and moves up and down by the movement of the shaft 13. A strain gauge type transducer 14 is attached to the shaft 13 and detects pressure applied to the shaft 13 in taking the glass or putting the glass on a package 3. A equipment control unit 15 judges whether the number of the glass 4 is one or two according to a detected pressure value and stops the movement of an equipment 11 for manufacturing a semiconductor in judging that the number of the glass 4 is two.
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