METHOD FOR PROCESSING SUBSTRATE, CATALYST PROCESS LIQUID, AND SUBSTRATE PROCESSING APPARATUS

摘要

Disclosed is a method for processing a substrate with improved throughput which enables to surely form a metal film on an exposed surface of an underlying metal such as wiring by nonelectrolytic plating without causing a void inside the underlying metal. In this method, the surface of a substrate on which an underlying metal is formed is cleaned with a cleaning liquid which is obtained by adding a surfactant into an organic acid having a carboxyl group or an aqueous solution of its salt; the cleaned surface of the substrate is brought into contact with a process liquid which is obtained by mixing the cleaning liquid with a solution containing metal catalyst ions, thereby applying the catalyst onto the substrate surface; and a metal film is formed over the substrate surface, to which the catalyst has been applied, through nonelectrolytic plating.