发明名称 Wet etchant composition and method for etching HfO2 and ZrO2
摘要 A wet etchant solution composition and method for etching oxides of hafnium and zirconium including at least one solvent present at greater than about 50 weight percent with respect to an arbitrary volume of the wet etchant solution; at least one chelating agent present at about 0.1 weight percent to about 10 weight percent with respect to an arbitrary volume of the wet etchant solution; and, at least one halogen containing acid present from about 0.0001 weight percent to about 10 weight percent with respect to an arbitrary volume of the wet etchant solution.
申请公布号 US6969688(B2) 申请公布日期 2005.11.29
申请号 US20020266880 申请日期 2002.10.08
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 PERNG BAW-CHING;CHEN FANG-CHENG;TAO HUN-JAN;HSU PENG-FU;HSIEH YUE-HO;WANG CHIH-CHENG;HSIAO SHIH-YI
分类号 H01L21/28;H01L21/302;H01L21/306;H01L21/311;H01L21/461;(IPC1-7):H01L21/302 主分类号 H01L21/28
代理机构 代理人
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