发明名称 Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths
摘要 A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.
申请公布号 US2006126293(A1) 申请公布日期 2006.06.15
申请号 US20040008732 申请日期 2004.12.09
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CAMPBELL LEVI A.;CHU RICHARD C.;ELLSWORTH MICHAEL J.JR.;IYENGAR MADHUSUDAN K.;SCHMIDT ROGER R.;SIMONS ROBERT E.
分类号 H05K7/20 主分类号 H05K7/20
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