发明名称 |
Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths |
摘要 |
A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.
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申请公布号 |
US2006126293(A1) |
申请公布日期 |
2006.06.15 |
申请号 |
US20040008732 |
申请日期 |
2004.12.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAMPBELL LEVI A.;CHU RICHARD C.;ELLSWORTH MICHAEL J.JR.;IYENGAR MADHUSUDAN K.;SCHMIDT ROGER R.;SIMONS ROBERT E. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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