发明名称 WAFER-TO-WAFER DEFECT INSPECTION SYSTEM
摘要 Equipment for detecting defect of wafer to wafer is provided to reduce costs, to detect in high speed, and to realize small equipment by including a robot, a wafer stage, a light module, and a control apparatus. A robot(200) transfers a wafer. The robot transfers the wafer from the outside to receive it on a wafer stage(100). A light module(300) emits light to the wafer received on the wafer stage and detects the reflected light. A control apparatus(400) detects the defect of the wafer by using the light detected by the light module. The wafer stage receives plural wafers. The wafer stage uses plural layers to receive plural wafers. The wafer stage detects the defect by rotating the received wafer. The light module detects the defect by scanning the wafer. The light module includes a light emitting light and a light absorbing unit. The light emitting unit emits the light to the wafer. The light absorbing unit detects the light reflected by the wafer.
申请公布号 KR20070074987(A) 申请公布日期 2007.07.18
申请号 KR20060003211 申请日期 2006.01.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, JAE WOO;JUN, CHUNG SAM;LEE, DONG CHUN;KIM, TAE SUNG
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
主权项
地址