| 摘要 |
A pumping line for use in an apparatus for manufacturing a semiconductor device is provided to minimize the condensation of processing byproducts onto an inner wall of an exhaust line using an optimized diameter of the exhaust line. A pumping line for use in an apparatus for manufacturing a semiconductor device is used to discharge processing byproducts generated from a processing gas within a process chamber(102) during a manufacturing process of the semiconductor device. The pumping line includes an inlet portion(202), a turbo pump(206) and an exhaust line(210). The inlet portion is formed at an exterior wall of the process chamber in which a material film is deposited on a semiconductor substrate. The turbo pump is used to pump an interior of the process chamber. The exhaust line through which a processing gas in the process chamber is discharged is used to connect the inlet portion with the turbo pump. The exhaust line has a diameter which prevents the processing byproducts from being condensed on an inner wall of the exhaust line. The diameter of the exhaust line is equal to or larger than 100 mm.
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