| 摘要 |
An RF module (20) adapted for direct surface mounting to the front end of a picocell or microcell. The module includes a circuit board (22) with a plurality of electrical components mounted thereon and defining respective RF signal transmit and receive sections. The signal transmit section is defined by at least a transmit bandpass filter (25), a power amplifier (26), an isolator (28), a coupler (30), and a duplexer (34). The signal receive section is defined by at least the duplexer (34), a receive low pass filter (36), a low-noise amplifier (39), and a receive bandpass filter (40). A lid (45) covers selected ones of the electrical components except for at least the power amplifier. Through-holes (136) in the circuit board below the power amplifier allow for the transfer of heat from the power amplifier. |
