| 摘要 |
A curved two-dimensional array transducer includes a layer of piezoelectric material overlaying a layer of ASICs which is attached to a backing wing. The piezoelectric material is diced in orthogonal azimuth and elevation directions to form a two-dimensional array of transducer elements, with the dicing cuts in the elevation direction extending through the ASIC layer so that the piezoelectric layer and the ASIC layer can be bent in the azimuth direction. The backing wing provides a flexible substrate which can be bent while supporting the ASIC layer and piezoelectric elements. In a second example the piezoelectric layer and ASIC layer are attached to opposite sides of flex circuit which provides the flexible substrate after the piezoelectric layer and ASIC layer are diced.
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