发明名称 |
POLISHING APPARATUS AND CONTROLLING THE SAME |
摘要 |
A polishing apparatus according to one embodiment includes: a turn table on which a polishing pad for polishing a substrate is provided; a turn table rotation mechanism configured to rotate the turn table; a dresser configured to dress the polishing pad by cutting a surface of the polishing pad; a pressing mechanism configured to press the dresser onto the polishing pad; a dresser rotation mechanism configured to rotate the dresser; a swinging mechanism configured to swing the dresser on the polishing pad; and a controller configured to control the pressing mechanism, the turn table rotation mechanism or the dresser rotation mechanism based on a position and a swinging direction of the dresser. |
申请公布号 |
US2016184961(A1) |
申请公布日期 |
2016.06.30 |
申请号 |
US201514977518 |
申请日期 |
2015.12.21 |
申请人 |
EBARA CORPORATION |
发明人 |
SHINOZAKI Hiroyuki |
分类号 |
B24B37/005 |
主分类号 |
B24B37/005 |
代理机构 |
|
代理人 |
|
主权项 |
1. A polishing apparatus comprising:
a turn table on which a polishing pad for polishing a substrate is provided; a turn table rotation mechanism configured to rotate the turn table; a dresser configured to dress the polishing pad by cutting a surface of the polishing pad; a pressing mechanism configured to press the dresser onto the polishing pad; a dresser rotation mechanism configured to rotate the dresser; a swinging mechanism configured to swing the dresser on the polishing pad; and a controller configured to control the pressing mechanism, the turn table rotation mechanism or the dresser rotation mechanism based on a position and a swinging direction of the dresser. |
地址 |
Tokyo JP |