IMPLANTABLE MEDICAL DEVICES AND METHODS OF FORMING SAME

摘要

Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

主权项

1. An implantable medical device system, comprising:
a housing; electronics disposed within the housing; a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics, the feedthrough assembly comprising a non-conductive substrate and a feedthrough, the feedthrough comprising:
a via from an outer surface to an inner surface of the non-conductive substrate;a conductive material disposed in the via; andan external contact disposed over the via on the outer surface of the non-conductive substrate, wherein the external contact is electrically coupled to the conductive material disposed in the via, and wherein the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via; and a connector header disposed on the housing of the implantable medical device, the connector header comprising a housing that surrounds the feedthrough assembly, wherein the connector header further comprises a receptacle adapted to receive a proximal portion of a lead and electrically couple a contact of the lead to the external contact of the feedthrough assembly.