SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device achieving an improvement in the manufacturing efficiency and capable of more reliably bonding between a semiconductor element and an electroconductive support member, and a method of manufacturing a semiconductor device.SOLUTION: A semiconductor device A1 includes: a semiconductor element 300 having a functional surface 310 formed with a functional circuit and a reverse surface 320 facing an opposite side with respect to the functional surface 310; a lead 101 supporting the semiconductor element 300 and electrically connected to the semiconductor element 300; and a resin package 400 covering the semiconductor element 300 and at least a part of the lead 101. The semiconductor element 300 has a functional surface side electrode 330 including: a functional surface side projection 334 formed to the functional surface 310 and projecting in a direction which the functional surface 310 faces; and a reinforcing layer 370 laminated on the functional surface 310. The semiconductor device further includes a first solid-state welded portion 510 formed by solid state welding of a part of the functional surface side projection 334 of the functional surface side electrode 330 and a part of the lead 101.SELECTED DRAWING: Figure 6