发明名称 SOCKET FOR ENGAGING MULTIPLE ELECTRONIC PACKAGES
摘要 PROBLEM TO BE SOLVED: To provide a socket capable of dealing with more than one package per socket, and reducing to the extent not causing an insertion force.SOLUTION: In a socket having a housing, a first pin receiving region is formed as a part of the housing. The first pin receiving region includes first plurality of electric contacts. A second pin receiving region is formed as a part of the housing. The second pin receiving region includes second plurality of electric contacts. An operation mechanism is configured to engage the first plurality of electric contacts with a first set of pins on a first electronic package, and to engage the second plurality of electric contacts with a second set of pins on a second electronic package.SELECTED DRAWING: Figure 9
申请公布号 JP2016127006(A) 申请公布日期 2016.07.11
申请号 JP20150230138 申请日期 2015.11.25
申请人 INTEL CORP 发明人 LIU KUANG;GREGORIO MURTAGIAN;DAVID J LLAPITAN;JEFFORY L SMALLEY;GAURAV CHAWLA;JOSHUA D HEPPNER;VIJAYKUMAR KRITHIVASAN;JONATHAN W THIBADO
分类号 H01R33/76 主分类号 H01R33/76
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