发明名称 REFRIGERANT CIRCULATION DEVICE, METHOD FOR CIRCULATING REFRIGERANT AND ACID SUPPRESSION METHOD
摘要 The present invention provides a heat pump device and an organic Rankine cycle device that are capable of maintaining a stable thermal cycle even when an HFO is used as the refrigerant in an environment in which the operating temperature reaches a high temperature. The refrigerant circulation device is filled with a refrigerant comprising a hydrofluoroolefin or hydrochlorofluoroolefin having a carbon-carbon double bond within the molecular structure, and has a region in the refrigerant circulation circuit where the operating temperature of the refrigerant reaches 175° C. or higher, wherein an acid suppression unit which suppresses any increase in the acid concentration in the refrigerant is provided in the region where the operating temperature of the refrigerant can reach 175° C. or higher, and the acid suppression unit contains an acid suppression material comprising at least two materials selected from the group consisting of copper, iron, aluminum, SUS, nickel, titanium, metallic silicon, silicon steel, tin, magnesium and zinc as the main components.
申请公布号 US2016201958(A1) 申请公布日期 2016.07.14
申请号 US201414914589 申请日期 2014.10.23
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD. ;CENTRAL GLASS CO., LTD. 发明人 UEDA Kenji;KOBAYASHI Naoki;AKAMATSU Yoshinori;SAKYU Fuyuhiko;NISHIGUCHI Yoshio
分类号 F25B43/00;C09K5/04;F25B30/02 主分类号 F25B43/00
代理机构 代理人
主权项 1. A refrigerant circulation device, which is filled with a refrigerant comprising a hydrofluoroolefin or hydrochlorofluoroolefin having a carbon-carbon double bond within a molecular structure, and has a region in a refrigerant circulation circuit where an operating temperature of the refrigerant reaches 175° C. or higher, wherein an acid suppression unit which suppresses any increase in a concentration of acid generated within the refrigerant is provided in a region where a temperature of the refrigerant can reach 175° C. or higher, and the acid suppression unit contains an acid suppression material comprising at least two materials selected from the group consisting of copper, iron, aluminum, nickel, titanium, metallic silicon, silicon steel, tin, magnesium, zinc and SUS as main components.
地址 Tokyo JP