INTEGRATED CIRCUIT STRUCTURE CONTAINING MULTIPLE SANDWICH LAYERS OF MONOCRYSTALLINE SEMICONDUCTOR AND INSULATOR MATERIAL,申请号USD3564358-传众专利搜索

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发明名称	INTEGRATED CIRCUIT STRUCTURE CONTAINING MULTIPLE SANDWICH LAYERS OF MONOCRYSTALLINE SEMICONDUCTOR AND INSULATOR MATERIAL
摘要
申请公布号	US3564358(A)	申请公布日期	1971.02.16
申请号	USD3564358	申请日期	1968.11.13
申请人	SIEMENS AG.	发明人	ALFONS HAHNLEIN
分类号	H01L21/00;H01L23/29;H01L27/00;H01L27/06;(IPC1-7):H01L19/00	主分类号	H01L21/00
代理机构		代理人
主权项
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