Epoxy resin compound - having low chlorine content and being resistan to electrolytic corrosion, used for encapsulation of electronic parts

摘要

Low-pressure moulding cpd. for encapsulating electronic components by transfer moulding comprises an epoxy resin derived from post-purified bisphenol-A and has Cl-content of is not >0.1 wt. %, pref. 0.05%. Low Cl-content prevents damage by electrolytic corrosion, esp. in presence of humidity and heat.