| 摘要 |
<p>PURPOSE:To attain the complicated circuit operating in an excellent way up to an ultrahigh frequency band by providing a wiring board comprising a microstrip line on and beneath and LCC package so as to attain the plural circuit wirings where wires are crossed. CONSTITUTION:The LCC package 1 is clipped by ceramic boards 2, 3. Ground conductors 20, 30, 12-27 and 31-33 and strip conductors 21-27 and 31-33 constitute a microstrip line. Electrodes of the LCC package 1 are soldered to the ceramic board 3 and other electrodes of the LCC package 1 are soldered to the board 2. In soldering the LCC package 1 onto the board 2, the solder between the LCC package 1 and the board 3 are not molten because of th temperature gradient of the LCC package 1 and the mounting with high reliability to the soldering is attained.</p> |
