| 摘要 |
<p>PURPOSE:To lessen stained defect which are caused by cutting chips in a visual checking process after a dicing process, by coating the whole surface of a wafer with a photoresist and removing the photoresist after dicing. CONSTITUTION:When a semiconductor device is manufactured through a dicing process where semiconductor elements formed on a semiconductor substrate are cut and separated one by one, a wafer 1 is wholly coated with a photoresist 2 prior to being treated by dicing and the photoresist 2 is removed after dicing. For example, the upper face of the semiconductor substrate (wafer) 1 is coated with the photoresist 2. Then, separation grooves 4 are made in the wafer coated with the photoresist by using a dicing blade in order to divide a large number of semiconductor elements formed on an upper part of the wafer 1 into each individual element and the separation grooves 4 are formed over the whole face of the wafer 1. Then, the photoresist 2 is removed. Thus, the wafer is divided and separated into each individual semiconductor element along the separation grooves 4.</p> |
