发明名称 Verbinder zwischen einer Tochterplatine und einer Mutterplatine für schnelle einseitig geerdete elektrische Signale
摘要 An assembly of two printed circuit boards (PCBs) mounted either perpendicular to or parallel to each other within a housing, each PCB bearing one or more low-profile high-density board-to-board commodity connectors providing equal numbers of electrical contacts. These commodity connectors mate to connectors permanently mounted on the daughterboard and backplane/sideplane. The assembly housing provides for semi-permanent attachment of the assembly to either the daughterboard or to the backplane/sideplane, as desired for a particular application. The housing may be made of conductive material in contact with earth ground to provide electromagnetic interference (EMI) shielding. Electrical continuity between the PCBs within the assembly is provided by signal conductors of specified electrical impedance and propagation delay. Each end of each signal conductor serves a pair of adjacent contacts in the connectors of both PCBs, such that each signal contact is adjacent to the shield contact of the same conductor, and adjacent only to the shield contacts served by other conductors, and not adjacent to the signal contacts served by other conductors. Multiple connector contacts may be provided for each conductor's shield, to further reduce shield (return path) inductance.
申请公布号 DE19729162(A1) 申请公布日期 1998.05.07
申请号 DE1997129162 申请日期 1997.07.08
申请人 HEWLETT-PACKARD CO., PALO ALTO, CALIF., US 发明人 SCHUMACHER, RICHARD A., DALLAS, TEX., US
分类号 H01R13/648;H01R12/70;H01R13/6474;H01R13/658;H01R24/00;H01R31/06 主分类号 H01R13/648
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